Products

Product overview and datasheets

The Hertzstück™ lead sulfide (PbS) detector is a short wave infrared (SWIR) semiconductor sensor for 1 – 3 µm wavelength. For Hertzstück™ PbS detectors we have developed a new, patent pending encapsulation technique: Hertzstück™ is the first bare chip lead salt photoconductor that can be wire-bonded to printed circuit boards. Using this chip-on-board (COB) technology Hertzstück™ enables your devices to be smaller, more flexible and more efficient. 

If your application needs a packaged detector, we also offer Hertzstück™ PbS sensors in TO packages. 

Exemplary specifications

Operating temperature [°C]-30 to +70
Storage temperature [°C]-55 to +70
Peak sensitivity wavelength λP [µm]2.2
20 % cut-off wavelength λC [µm]2.9
Time constant [µs]200
Dark resistance Rd [MΩ]0.3 to 3.0
Min D* (606 Hz, 1 Hz) [cm·Hz½/W]5 ∙ 1010
Peak D* (606 Hz, 1 Hz) [cm·Hz½/W]1 ∙ 1011
RoHScompliant

Thin film encapsulation

Active area [mm x mm]Peak responsivity S [V/W]Datasheet
0.5x0.516 ∙ 105PDF
1x18 ∙ 105PDF
2x24 ∙ 105PDF
3x33 ∙ 105PDF
6x61.4 ∙ 105PDF
10x106.0 ∙ 104PDF

Double encapsulation (thin-film and TO)

Active area [mm x mm]Peak responsivity S [V/W]Datasheet
0.5x0.516 ∙ 105PDF
1x18 ∙ 105PDF
2x24 ∙ 105PDF
3x33 ∙ 105PDF

Bare chip solutions

Our encapsulation technology allows Hertzstück™ detectors to be directly wire bonded on printed circuit boards. Bare chip solutions enable small, flexible and very efficient devices. 

We can offer a test kit, a bonded bare chip on a pluggable board, so that you can experience Hertzstück™ in your application. We can also support you in bonding our bare chips. For small volumes we offer in-house bonding and can work closely together with you to find the optimum bond parameters for your application. To learn more about how you can integrate a bare chip detector into your device, get into contact with our engineers.

Transistor Outline (TO) package solutions

The infrared detectors Hertzstück™ are also available with double encapsulation for higher safety and longer lifetime. The sensors are not only protected by a TO-package, but also by a novel thin-film encapsulation directly on the chip. This patent-pending technique ensures not only longer lifetime, but also highest detectivity up to 3µm (at room temperature) and thus increased safety.

Current production processes for optical devices in the semiconductor industry are optimized for TO-packages. Hertzstück™ double-encapsulated sensors are fully compatible to such automated production and can readily replace existing single-encapsulated sensors.

Customized detectors and upcoming products

Are you looking for smaller and bigger sensor sizes, TE cooled photoconductors, linear arrays, detectors with grids, or custom specifications? We are committed to offer the right solution for your IR sensing application. 

Already in our pipeline: Hertzstück™ PbSe detectors for 2 – 5 µm wavelength as bare chip and TO packaged sensors. Get in contact with us and we will inform you as soon as Hertzstück™ PbSe detectors are available.

Applications

Applications like moisture detection, gas sensing, spectroscopy, flame control and chemical analysis depend on reliable detection of infrared light. Hertzstück™ offers distinctive advantages for your measurement:

For the use of Hertzstück™ PbS and PbSe infrared photodetectors  in medical devices, monitoring and control instruments and consumer applications RoHS exemptions apply. 

For automotive applications Hertzstück™ PbS and PbSe infrared photodetectors fall under ELV exemption.